COPPER FILM WITH BURIED FILM RESISTOR AND PRINTED CIRCUIT BOARD HAVING THE SAME

摘要

The present invention relates to a copper thin film resistor and a printed circuit board having the corresponding copper thin film resistor. More particularly, nickel, chrome, tungsten, a nickel compound, a chrome compound, a tungsten compound, a nickel alloy, a chrome alloy, or a tungsten alloy is used for an electric resistor layer, the copper thin film resistor is formed by using the corresponding electric resistor layer and a copper thin film, and the copper thin film resistor is one that is combined with a substrate to be suitable for finishing a printed circuit board. Here, in the contents that deserve to be described, because a sputtered alloy, a metal, or a metal compound resistant layer having a plating layer precision and a continuity that are relatively excellent, the minimum value of the electric resistance on a surface thereof is smaller than or equal to 5Ω/□, and the alloy, the metal, or the metal compound resistance film manufactured through a sputtering technology may be effectively decrease the amount of industrial wasted water at the same time. The more important thing is that an electric resistance element that is necessary when an electronic circuit is to be manufactured on a printed circuit board including a copper thin film resistor that is the present invention requires only two etching manufacturing processes in the corresponding printed circuit board structure.