Circuit connecting adhesive film and its manufacturing method, circuit connecting structure manufacturing method, and adhesive film accommodation set

摘要

A first adhesive layer (2) and a second adhesive layer (3) stacked on the first adhesive layer (2) are provided, and the first adhesive layer (2) contains a cured product of a photocurable composition, The second adhesive layer 3 includes a thermosetting composition, and the photocurable composition is a polymerizable compound, conductive particles 4, a structure represented by the following formula (I), a structure represented by the following formula (II), and the following formula An adhesive film for circuit connection (1) containing a photopolymerization initiator having at least one structure selected from the group consisting of structures represented by (III).