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SUBSTRATE DESTATICIZING MECHANISM AND VACUUM TREATMENT APPARATUS USING SAME
SUBSTRATE DESTATICIZING MECHANISM AND VACUUM TREATMENT APPARATUS USING SAME
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机译:使用相同的基质去静电机理和真空处理装置
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摘要
In the apparatus which processes film-forming etc. in a film-form board | substrate etc. in a vacuum, the technique which can efficiently perform static elimination with a simple structure, without affecting a process area | region is provided. This invention is a board | substrate electrostatic mechanism which performs static electricity with magnetron discharge with respect to the film 10 for film-forming conveyed in vacuum. In the present invention, the housing 51 into which the discharge gas is introduced, the discharge electrode 53 of the linear shape disposed in the housing 51 orthogonal to the substrate conveyance direction, to which a predetermined voltage is applied, and the discharge electrode ( The magnet 54A is disposed in the vicinity of 53, and the magnet 54A is arranged to generate a discharge in accordance with the distribution of the charge amount in the film 10 for film formation.
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