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Epitaxial wafer backside inspection apparatus and epitaxial wafer backside inspection method using the same

机译:外延晶片背面检查装置及使用该装置的外延晶片背面检查方法

摘要

An epitaxial wafer back surface inspection apparatus capable of detecting a defect on the back surface of an epitaxial wafer is provided. The epitaxial wafer backside inspection apparatus 100 of the present invention includes an optical system 30 including a ring fiber illumination 10 and a photographing unit 20, which is provided perpendicular to the backside of the epitaxial wafer 1, It has the scanning part 40 which scans the optical system 30 in parallel with the said back surface, The light source of the ring fiber illumination 10 is characterized by being any one of a blue LED and a red LED.
机译:提供一种能够检测外延晶片的背面上的缺陷的外延晶片背面检查装置。本发明的外延晶片背面检查装置100包括光学系统30,该光学系统30包括环形光纤照明装置10和拍摄单元20,其垂直于外延晶片1的背面设置,并且具有扫描部件40。与所述背面平行的光学系统30,其特征在于,环形光纤照明装置10的光源是蓝色LED和红色LED中的任一个。

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