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Epitaxial wafer backside inspection apparatus and epitaxial wafer backside inspection method using the same
Epitaxial wafer backside inspection apparatus and epitaxial wafer backside inspection method using the same
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机译:外延晶片背面检查装置及使用该装置的外延晶片背面检查方法
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摘要
An epitaxial wafer back surface inspection apparatus capable of detecting a defect on the back surface of an epitaxial wafer is provided. The epitaxial wafer backside inspection apparatus 100 of the present invention includes an optical system 30 including a ring fiber illumination 10 and a photographing unit 20, which is provided perpendicular to the backside of the epitaxial wafer 1, It has the scanning part 40 which scans the optical system 30 in parallel with the said back surface, The light source of the ring fiber illumination 10 is characterized by being any one of a blue LED and a red LED.
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