COVERLAY FILM FLEXIBLE PRINTED CIRCUIT BOARD USING THE SAME AND MENUFACTURING METHOD FOR THOSE

摘要

The coverlay film of the present invention includes (A) a specific vinyl compound, (B) a polystyrene-poly (ethylene / butylene) block copolymer, (C) a polystyrene-poly (ethylene-ethylene / propylene) block copolymer, (D) ) Epoxy resin, (E) bismaleimide, and the mass ratio of each component is (A + E) / (B + C) = 0.81-1, (B) / (C) = 1-4, and The adhesive layer containing 1-10 mass% of the said component (D) with respect to the total mass of (A)-(E) has a melting point higher than the thermosetting temperature of the said adhesive layer, and permittivity in the range of frequency 1-10 GHz. This is 4 or less, and is formed on one surface of the organic film having a dielectric loss tangent of 0.02 or less.