首页>
外国专利>
NiPt FORMULATIONS FOR WET ETCHING NIPT DURING SILICIDE FABRICATION
NiPt FORMULATIONS FOR WET ETCHING NIPT DURING SILICIDE FABRICATION
展开▼
机译:在硅化物制造期间用于湿蚀刻的NiPt配方
展开▼
页面导航
摘要
著录项
相似文献
摘要
The present invention relates to compositions and methods for substantially effectively removing such materials from microelectronic devices with NiPt (1-25%) material on top. The composition is substantially compatible with other materials, such as gate metal materials, present on the microelectronic device.
展开▼