首页> 外国专利> LIGHTING MODULE HAVING ENHANCED HEAT RADIATION PERFORMANCE BENT TYPE HEAT PLATE USED THEREFOR

LIGHTING MODULE HAVING ENHANCED HEAT RADIATION PERFORMANCE BENT TYPE HEAT PLATE USED THEREFOR

机译:所使用的照明模块具有增强的热辐射性能,弯曲型热板

摘要

The present invention, a light source; A circuit board on which the light source is mounted; And a heat plate coupled to the circuit board and discharging heat generated by the light source, wherein the heat plate is disposed to face the bottom surface of the circuit board to support the circuit board, and through the circuit board, A heat collection unit that receives heat from the light source; And a heat diffusion discharge part which is bently extended from the heat collection part to face the side surface of the circuit board and diffuses and discharges the heat received from the heat collection part, a light emitting module having improved heat dissipation performance, a bending used therein Provide a heat plate.
机译:本发明的光源;安装有光源的电路板;一热板,其耦接至所述电路板并散发由所述光源产生的热量,其中,所述热板设置成面对所述电路板的底面以支撑所述电路板,并通过所述电路板。从光源接收热量;并且,从所述集热部弯曲地延伸以面对所述电路板的侧表面并扩散和散发从所述集热部接收的热量的散热散出部,具有改善的散热性能的发光模块,使用了弯曲在其中提供一个加热板。

著录项

  • 公开/公告号KR102131203B1

    专利类型

  • 公开/公告日2020-07-07

    原文格式PDF

  • 申请/专利权人 주식회사 씨지아이;

    申请/专利号KR20180093855

  • 发明设计人 김병호;공유찬;조영수;

    申请日2018-08-10

  • 分类号G02F1/13357;G02F1/1333;

  • 国家 KR

  • 入库时间 2022-08-21 11:04:15

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