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LIGHTING MODULE HAVING ENHANCED HEAT RADIATION PERFORMANCE BENT TYPE HEAT PLATE USED THEREFOR AND METHOD FOR MANUFACTURING BENT TYPE HEAT PLATE
LIGHTING MODULE HAVING ENHANCED HEAT RADIATION PERFORMANCE BENT TYPE HEAT PLATE USED THEREFOR AND METHOD FOR MANUFACTURING BENT TYPE HEAT PLATE
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机译:具有增强的热辐射性能的弯曲模块使用的弯曲型热板以及制造弯曲型热板的方法
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摘要
Provided are a light emitting module having improved heat radiation performance, a bending type heat plate used therefor, and a manufacturing method of the bending type heat plate. The light emitting module having improved heat radiation performance comprises: a light source; a circuit board on which the light source is mounted; and a heat plate coupled with the circuit board and discharging heat generated in the light source. The heat plate includes: a heat collection unit disposed to face a bottom surface of the circuit board so as to support the circuit board and receiving the heat from the light source through the circuit board; and a heat diffusion and discharge unit bent and extended from the heat collection unit to be disposed to face a side surface of the circuit board and diffusing and discharging the heat received from the heat collection unit.
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