RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD MATERIAL AND PREPREG RESIN SHEET METAL FOIL-LAMINATED BOARD AND PRINTED CIRCUIT BOARD EMPLOYING SAME

摘要

As a resin composition used as a material for the insulating layer of a printed wiring board comprising an insulating layer and a conductor layer formed by plating on the surface of the insulating layer, an epoxy compound (A), a cyanate ester compound (B), The maleimide compound (C), the inorganic filler (D), and the imidazole silane (E) are included, and the maleimide compound (C) contains a predetermined maleimide compound, and the maleimide compound (C) is Content is 25 mass% or less with respect to 100 mass% of the total content of the said epoxy compound (A), said cyanic acid ester compound (B), and said maleimide compound (C), and said imidazole silane (E) A resin composition containing a compound represented by this, the following formula (3).