Nickel plating method for nickel plating layer having uniform thickness on complex structure

摘要

In one embodiment of the present invention, the negative electrode reciprocates in any one or more of the horizontal axis direction and the vertical axis direction, and the stroke range in the horizontal or vertical axis direction of the reciprocating motion is ± 1 to 5 cm, and the horizontal axis or By providing a nickel plating method, characterized in that the reciprocating speed in the vertical axis direction is 2 to 10 Hz, the cathode electrode is moved to remove hydrogen bubbles on the cathode surface, and a compound having a specific chemical structure is used as a planarizing agent for nickel electrolytic plating, There is an effect of forming a nickel plated film having a uniform thickness on a complex structure substrate having a curved surface having a complex shape.