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METHOD OF PRODUCING ELECTROTECHNICAL THIN FILMS AT ROOM TEMPERATURE AND ELECTROTECHNICAL THIN FILM

机译:在室温下生产电工薄膜和电工薄膜的方法

摘要

FIELD: manufacturing technology; technological processes.;SUBSTANCE: invention can be used to produce an electrotechnical thin film. Essence of the invention is that in the method of producing electrotechnical thin films at room temperature by providing electroconductive and/or semiconductor inorganic agglomerates in the dispersion on the surface and curing them to form a layer, curing is carried out at room temperature and curing is accelerated by bringing into contact with at least one reagent, where the dispersion is in form of an aqueous wet dispersion—an aqueous wet dispersion, where the room temperature is temperature of 10 °C to 60 °C, where electrotechnical thin film is modified on the edge in an incompletely cured state by means of at least one acid halide reagent, or at least one redox reagent selected from a group consisting of halogen, a halogen compound and a chalcogen, fluorine, chlorine, bromine, iodine, hypogalite, halite, halogenate, perhalogenate, light photons of UV range, oxygen, oxygen enriched with ozone, ozone, perborate, percarbonate, peroxodisulphate, or at least one acidic or basic reagent selected from a group consisting of halogenhydrogen, acid hypogalite, acid halite, halogen-containing acid, halogen-containing peracid, hypochlorous acid, chloride acid, chloric acid, perchloric acid, dry CO2, dry NH3, thionyl chloride, sulphuryl chloride, phosphorus oxychloride, phosphorus trichloride.;EFFECT: possibility of creating thin, strong and stable films.;5 cl, 2 dwg
机译:领域:制造技术;技术过程。实质:发明可用于生产电工薄膜。本发明的本质在于,在室温下通过在表面的分散体中提供导电和/或半导体无机团聚物并使其固化以形成层的方法来制备电工薄膜的方法是在室温下进行固化,然后在室温下进行固化。通过与至少一种试剂接触而加速,其中分散体为水湿分散体的形式-水湿分散体,其室温为10°C至60°C的温度,其中对电工薄膜进行了改性通过至少一种酰基卤试剂,或至少一种选自卤素,卤素化合物和硫族元素,氟,氯,溴,碘,次氯酸钠,卤石的氧化还原试剂,以不完全固化的状态形成边缘;卤化物,全卤化物,紫外线范围的光子,氧气,富含臭氧的氧气,臭氧,过硼酸盐,过碳酸盐,过二硫酸盐或至少一种酸性或碱性试剂选自以下组中的一种:卤素氢,酸性次硼酸盐,酸性岩盐,含卤素的酸,含卤素的过酸,次氯酸,氯酸,氯酸,高氯酸,干燥的CO 2 ,干燥的NH < Sub> 3 ,亚硫酰氯,硫酰氯,三氯氧化磷,三氯化磷;效果:可能形成薄,坚固而稳定的薄膜; 5 cl,2 dwg

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