首页> 外国专利> Method for optimizing laser processing carried out with a laser processing device, as well as laser processing device

Method for optimizing laser processing carried out with a laser processing device, as well as laser processing device

机译:用于优化由激光加工装置执行的激光加工的方法以及激光加工装置

摘要

The present invention relates to a method for optimizing a laser processing carried out with a laser processing device, wherein in the course of the laser processing a laser radiation source (1) generates laser radiation (10) and emits it along an optical path (2) in the direction of a working plane (3) the laser radiation (10) is modulated by means of a spatial light modulator (4) arranged downstream of the laser radiation source (1) in the optical path (2), and wherein the modulated laser radiation (20) is focused on the working plane (3), comprising the following , steps carried out in a closed-loop control loop: i. Determining at least one actual feature of the laser radiation (10) and / or the modulated laser radiation (20) using at least one camera unit (K1, K2, K3, KA); ii. Comparing the at least one actual feature of the laser radiation (10) and / or the modulated laser radiation (20) with at least one predetermined target feature and determining a respective feature deviation; iii. Assessment of the feature deviation and, if necessary, adjustment of at least one setting parameter. Furthermore, the invention relates to a laser processing device which is set up to carry out the method according to the invention. With the method on which the invention is based and the laser processing device, simplified monitoring and control of the alignment and shaping of laser radiation is achieved enables. The process provides a basis for laser processing with shaped laser radiation with high process stability.
机译:本发明涉及一种用于优化利用激光加工装置执行的激光加工的方法,其中,在激光加工的过程中,激光辐射源(1)产生激光辐射(10)并沿光路(2)发射。 )在工作平面(3)的方向上通过空间光调制器(4)调制激光辐射(10),该空间光调制器在光路(2)中位于激光辐射源(1)的下游。调制激光辐射(20)聚焦在工作平面(3)上,包括在闭环控制回路中执行的以下步骤:使用至少一个摄像机单元(K1,K2,K3,KA)确定激光辐射(10)和/或调制激光辐射(20)的至少一个实际特征; ii。将激光辐射(10)和/或调制激光辐射(20)的至少一个实际特征与至少一个预定目标特征进行比较,并确定各自的特征偏差; iii。评估特征偏差,并在必要时调整至少一个设置参数。此外,本发明涉及一种设置成执行根据本发明的方法的激光加工装置。利用本发明所基于的方法和激光处理装置,能够实现对激光辐射的对准和整形的简化监视和控制。该工艺为具有高工艺稳定性的成形激光辐射进行激光加工提供了基础。

著录项

  • 公开/公告号DE102019111501A1

    专利类型

  • 公开/公告日2020-11-05

    原文格式PDF

  • 申请/专利权人 PULSAR PHOTONICS GMBH;

    申请/专利号DE201910111501

  • 发明设计人 STEPHAN EIFEL;JENS HOLTKAMP;JOACHIM RYLL;

    申请日2019-05-03

  • 分类号B23K26;B23K26/70;B23K26/064;B23K26/073;G05B13/02;G02B27/09;

  • 国家 DE

  • 入库时间 2022-08-21 11:01:22

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