首页> 外国专利> Printing facility and procedure

Printing facility and procedure

机译:印刷设备和程序

摘要

The invention relates to a printing device (1) for printing flat substrates (2), in particular printed circuit boards, wafers or solar cells, and having a print head (6) which is designed to print at least one substrate (2) with a printing compound, with a Printing table (3) which is designed to hold the at least one substrate (2) during printing and, in particular, to align it with the print head (6). An assembly device (12) for identification chips (15) is provided, in particular RFID chips, which is designed to apply an identification chip (15) to a substrate (2), in particular already printed by the printing device.
机译:本发明涉及一种印刷装置(1),其用于印刷平坦的基板(2),特别是印刷电路板,晶片或太阳能电池,并且具有印刷头(6),该印刷头被设计为用以下方式印刷至少一个基板(2):一种具有印刷台(3)的印刷化合物,所述印刷台被设计成在印刷期间保持至少一个基板(2),并且尤其是使其与印刷头(6)对准。提供了一种用于识别芯片(15),特别是RFID芯片的组装设备(12),该组装设备(12)被设计用于将识别芯片(15)施加到特别是已经由印刷设备印刷的基板(2)上。

著录项

  • 公开/公告号DE102019202245A1

    专利类型

  • 公开/公告日2020-08-20

    原文格式PDF

  • 申请/专利权人 EKRA AUTOMATISIERUNGSSYSTEME GMBH;

    申请/专利号DE201910202245

  • 发明设计人 TORSTEN VEGELAHN;

    申请日2019-02-19

  • 分类号B41J13/12;H05K3/12;G06K19/077;

  • 国家 DE

  • 入库时间 2022-08-21 11:01:13

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号