Optical correction element, projection exposure system for semiconductor lithography with a correction element and method for designing a correction element

摘要

The invention relates to an optical correction element (30) comprising at least one thermal actuator (32) for manipulating the temperature distribution over the optical correction element (30), the thermal actuator (32) comprising at least one heating zone (35) and a connection (38, 38 ') , Furthermore, the at least two sections (41) of the heating zone (35) are designed such that they have a different heating power density. In addition, the invention relates to a method for designing an optical correction element (30) comprising the following method steps: a) Selection of at least one desired temperature target profile (45) .b) Modeling a temperature profile of the optical correction element (30) as a function of the local heat output distribution in the at least one heating zone (35) .c) Comparison of the temperature profile modeled with the local heat output distribution with the temperature target profile (45) .d) adjustment the local heat output distribution e) repeating steps b) to d) until an optimum is found. Furthermore, the invention relates to a method for correcting the optical properties of a projection exposure system (1) with an optical correction element (30), comprising the following method steps: a ) Determination a parameter for characterizing the optical performance of the projection exposure system (1) .b) controlling or regulating the optical correction element (30) to adapt the parameter