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DIAMOND SUBSTRATE PRODUCTION PROCESS

机译:金刚石基材生产工艺

摘要

A diamond substrate manufacturing method includes a step of forming a band-shaped separation layer with applying a laser beam to a diamond ingot by moving the diamond ingot relative to each other and a focal point of the laser beam in a [110] direction perpendicular to a (110) plane, thereby forming a band-shaped one Form a separation layer, which extends inside the diamond ingot in the [110] direction, a grading step with moving the diamond ingot and the focal point relative to each other in a graduation direction parallel to a (001) plane and perpendicular to the [110] direction , a step of forming a planar separating layer with repeating the step of forming a band-shaped separating layer and the dividing step to thereby form a planar separating layer inside the diamond ingot parallel to the (001) plane, the planar separating layer consisting of a plurality of band-shaped separating layers, the S are arranged side by side in the division direction, is constructed, and a separation step with a separation of a diamond substrate along the planar separation layer from the diamond ingot.
机译:金刚石基板的制造方法包括以下步骤:通过使金刚石晶锭彼此相对并且使激光束的焦点沿垂直于[110]方向的方向移动,从而通过向金刚石晶锭施加激光束来形成带状分离层。 (110)平面,从而形成一个带状的平面。形成一个分离层,该分离层在[110]方向上在金刚石锭内部延伸,进行渐变步骤,使金刚石锭和焦点相对于刻度进行相对移动在平行于(001)平面并垂直于[110]方向的方向上,重复形成带状隔离层的步骤和分割步骤,从而形成平面隔离层的步骤,从而形成在内部的平面隔离层。平行于(001)面的金刚石铸锭,构成由多个带状的分离层构成的平面的分离层,将S沿分割方向并排配置,并形成分离台阶。 ep沿着平面分离层将金刚石基底与金刚石锭分离。

著录项

  • 公开/公告号DE102019214897A1

    专利类型

  • 公开/公告日2020-04-02

    原文格式PDF

  • 申请/专利权人 DISCO CORPORATION;

    申请/专利号DE201910214897

  • 发明设计人 ASAHI NOMOTO;KAZUYA HIRATA;

    申请日2019-09-27

  • 分类号B28D5;H01L21/301;

  • 国家 DE

  • 入库时间 2022-08-21 11:01:12

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