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Film-closure apparatus for plastic film material

机译:塑料薄膜材料的封膜装置

摘要

A printed circuit board 130 has a heating element 138 printed on at least part of its edge. Different boards can have elements generating different temperatures from the same voltage or current. The element can be positioned in the guide path of a film-closure apparatus 10 which has drive means 12 for moving the film material along the guide path 14. The heating element can include four spaced parallel exposed conductors extending along the edge. The element could extend all the way along a longitudinal edge of a rectangular PCB. The heating element could protrude from the edge. The circuit substrate could be polyimide and the heating element can be copper. The heating element can project from a casing 20 which includes sprung terminals to electrically connect the PCB to a power source. There can be two heating elements projecting towards each other from cases on opposite sides of the guide paths. The PCB can include a screw hole for mounting. A printed resistance track can be configured to give a desired resistance and a thermistor to regulate temperature.
机译:印刷电路板130具有在其边缘的至少一部分上印刷的加热元件138。不同的电路板可以具有从相同电压或电流产生不同温度的元件。所述元件可以被定位在具有用于使薄膜材料沿着引导路径14移动的驱动装置12的薄膜闭合设备10的引导路径中。加热元件可以包括沿着边缘延伸的四个间隔开的平行暴露的导体。该元件可以沿着矩形PCB的纵向边缘一直延伸。加热元件可能会从边缘突出。电路基板可以是聚酰亚胺,并且加热元件可以是铜。加热元件可以从壳体20突出,壳体20包括弹簧端子,以将PCB电连接到电源。在导轨的相对侧上可以有两个加热元件,它们从壳体朝向彼此突出。 PCB可以包括用于安装的螺孔。印刷的电阻迹线可以配置为提供所需的电阻和热敏电阻以调节温度。

著录项

  • 公开/公告号GB2582166A

    专利类型

  • 公开/公告日2020-09-16

    原文格式PDF

  • 申请/专利权人 GREEN LIGHT PACKAGING LIMITED;

    申请/专利号GB20190003440

  • 发明设计人 MARK BONNING;

    申请日2019-03-13

  • 分类号B65B51/10;B29C65/22;H05B3/06;H05K1/02;

  • 国家 GB

  • 入库时间 2022-08-21 10:59:50

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