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Metal containing film forming composition for extreme ultraviolet or electron beam lithography, metal containing film for extreme ultraviolet or electron beam lithography and pattern forming method
Metal containing film forming composition for extreme ultraviolet or electron beam lithography, metal containing film for extreme ultraviolet or electron beam lithography and pattern forming method
The purpose of this invention is to provide an extreme ultraviolet ray or a metal containing film forming composition for electron beam lithography, a metal containing film for an extreme ultraviolet ray or an electron beam lithography, and a pattern forming method capable of forming a metal containing film excellent in suppressing the coating film thickness change and suppressing the sensitivity of the resist sensitivity change.The present invention relates toCompounds having metal oxygen covalent bondsContains a solvent andThe metal element constituting the above compound isThe periodic table belongs to the third to seventh periods of the third to fifteenth groupsSaid solventA first solvent component which is less than a standard boiling pointContains a second solvent component having a standard boiling point of 160 or more and less than 400The solvent contains an alcohol solventIt is an extreme ultraviolet ray or a metal containing film forming composition for electron beam lithography in which the content of the alcohol solvent in the above solvent is 30 mass% or more.
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