ウェーハの加工方法

摘要

Problem to be solved: to form device chips without degrading quality.A method of processing a wafer wherein a plurality of devices divide the wafer formed on the surface into individual device chips;A polyolefin sheet arrangement in which a polyolefin sheet is disposed on the back surface of a waferHeat the polyolefin sheet with hot air.The wafer andThe polyolefin sheetIntegrated process for integratingA first frame comprising a plurality of magnets andThe second frame andUse the frame of theThe first frame with magnetic forceThe second frame and theA frame support step wherein the polyolefin sheet is supported by the frame by sandwiching the outer peripheral portion of a polyolefin sheet between themA dividing step for forming a split groove along the split schedule line and dividing the wafer into individual device chipsHeat the polyolefin sheetPick up the device tip and pick up the.Diagram