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COMPOSANTS PASSIFS MIS EN OEUVRE SUR UNE PLURALITÉ D'ISOLANTS EMPILÉS
COMPOSANTS PASSIFS MIS EN OEUVRE SUR UNE PLURALITÉ D'ISOLANTS EMPILÉS
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摘要
The present disclosure provides integrated circuit apparatuses and methods for manufacturing integrated circuit apparatuses. An integrated circuit apparatus may include a first insulator, the first insulator being substantially planar and having a first top surface and a first bottom surface opposite the first top surface, a first conductor disposed on the first insulator, a second insulator, the second insulator being substantially planar and having a second top surface and a second bottom surface opposite the second top surface, a second conductor disposed on the second insulator, and a dielectric layer disposed between the first bottom conductor of the first insulator and the second top conductor of the second insulator.
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