SYSTÈME D'INSPECTION NON DESTRUCTIVE POUR DÉTECTER DES DÉFAUTS DANS UNE TRANCHE DE SEMICONDUCTEUR DE COMPOSÉ ET SON PROCÉDÉ DE FONCTIONNEMENT

摘要

Provided are a non-destructive inspection system for detecting the absence or presence of an internal defect of a semiconductor wafer and a location of the internal defect in a non-destructive manner without physically deforming the semiconductor wafer, and a method of operating the non-destructive inspection system. Also provided are a non-destructive inspection system for inspecting response characteristics with respect to X-rays or gamma-rays , and a method of operating the non-destructive inspection system.