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Demolding of hot embossed polymer microstructures

机译:热压花聚合物微结构的脱模

摘要

Polymer-based microfluidic "lab on a chip" technology promises to reduce cost and extend access to medical diagnostic tests that formerly required expensive and labor-intensive lab work. The predominant methods for manufacturing these devices are miniaturized molding processes including casting, injection molding, and hot embossing. These techniques have in common the use of a mold to define the shape of functional features (fluidic channels), the separation of the part from the mold as a process step (demolding), and the intended re-use of the mold to produce additional parts. The demolding step in particular poses significant challenges for mass production. Demolding affects several issues including production rate, part quality, and mold lifetime, and demolding-related defects are frequently observed. Despite its importance, there has been no comprehensive effort to analyze demolding theoretically or experimentally. This thesis aims to deepen the understanding of demolding of polymer microstructures in order to facilitate mass manufacturing of polymer-based devices with micro-scale functional features, such as microfluidic chips. A theory of demolding mechanics has been proposed that combines the effects of thermal stress, friction, and adhesion in a unified framework. A metric by which demolding can be characterized experimentally--the demolding work--has been proposed by analogy with interfacial fracture and has been related to underlying physical mechanisms. Finite element simulations based on this theory of demolding have been performed to investigate the effects of important parameters, including demolding temperature and feature geometry. A test method for characterizing demolding by directly measuring the demolding work for individual microstructures has been developed and applied to hot embossing to study the effects of process parameters such as demolding temperature, the effects of feature geometry and layout, and the impacts of mitigation strategies such as low-adhesion mold coatings. The results of these demolding experiments broadly agree with expected trends based on the theory of demolding mechanics proposed herein. A dimensionless parameter aggregating the effects of feature geometry and layout has been identified and related to the occurrence of demolding-related defects, the demolding process window, and the demolding temperature that minimizes the demolding work. These findings have been generalized to provide processing and design guidance for industrial application of polymer micro-molding.
机译:基于聚合物的微流体“芯片实验室”技术有望降低成本,并扩大以前需要昂贵且劳动密集型实验室工作的医学诊断测试的使用范围。制造这些设备的主要方法是小型化成型工艺,包括铸造,注塑成型和热压花。这些技术通常使用模具来定义功能特征(流体通道)的形状,将零件从模具中分离出来作为加工步骤(脱模),以及打算重复使用模具以生产其他产品部分。脱模步骤尤其对批量生产提出了重大挑战。脱模影响几个问题,包括生产率,零件质量和模具寿命,并且经常观察到与脱模有关的缺陷。尽管它很重要,但仍没有进行全面的理论或实验分析脱模。本文旨在加深对聚合物微结构脱模的理解,以促进具有微尺度功能特征的聚合物基器件(如微流控芯片)的批量生产。提出了一种脱模力学理论,该理论在统一的框架中结合了热应力,摩擦和附着力的影响。已经通过类似于界面断裂的方法提出了一种可以通过实验表征脱模的度量标准(脱模工作),并且该脱模方法与潜在的物理机制有关。已经进行了基于脱模理论的有限元模拟,以研究重要参数的影响,包括脱模温度和特征几何形状。已经开发了一种通过直接测量单个微结构的脱模性能来表征脱模的测试方法,并将其应用于热压印,以研究诸如脱模温度等工艺参数的影响,特征几何形状和布局的影响以及缓解策略的影响,例如作为低粘附力的模具涂料。基于本文提出的脱模力学理论,这些脱模实验的结果与预期趋势大致吻合。已经确定了聚集特征几何形状和布局影响的无量纲参数,该参数与脱模相关缺陷的发生,脱模过程窗口以及使脱模工作最少的脱模温度有关。这些发现已被概括为聚合物微成型的工业应用提供加工和设计指导。

著录项

  • 作者

    Dirckx Matthew E;

  • 作者单位
  • 年度 2010
  • 总页数
  • 原文格式 PDF
  • 正文语种 eng
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