Effects of Moisture, Residual Thermal Curing Stresses and Mechanical Load on the Damage Development in Quasi-Isotropic Laminates

摘要

This investigation demonstrates how the maximum moisture absorbed (that is the wet condition) in (0/plus or minus 45/90)s and (0/90/plus or minus 45)s laminates fabricated from T300/5208 significantly alters the dry stress state and subsequent damage development along the laminate free edge.