Comparison of Matrix Cracking in Melt-Infiltrated SiC/SiC Composites with 3D and 2D-Woven Orthogonal Architectures

摘要

Acoustic emission techniques combined with microstructural observations were used to determine the dependence of through thickness matrix cracking (TTMC) on in-plane tensile stress for melt infiltrated Sylramic fiber-based SIC/SiC composite panels with various 3D-woven orthogonal fiber architectures. Results were compared with prior TTMC results from similar panels with 2D woven orthogonal architectures.Both data sets were analysed on the basis that the source for TTMC originated in the 90 degree or Z-fiber tows.