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Shape-Memory Alloy Thermal Conduction Switch for Use at Cryogenic Temperatures

机译:用于低温的形状记忆合金热传导开关

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The following summarizes the activities performed under NASA grant NAG10-323 from September 1, 2002 through September 30, 2004 at the. University of Central Florida. A version of this has already been submitted for publication in the international journal Swart Materials and Structures in December 2004. Additionally, a version of this has already appeared in print in Advances in Cryogenic Engineering, American Institute of Physics, (2004) 50A 26-3; in an article entitled "A Shape Memory Alloy Based Cryogenic Thermal Conduction Switch" by V.B. Krishnan. J.D. Singh. T.R. Woodruff. W.U. Notardonato and R. Vaidyanathan (article is attached at the end of this report).

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