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Techniques for the evaluation of outgassing from polymeric wafer pods

机译:用于评估聚合物晶片盒的除气的技术

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In recent years there has been increasing interest in using wafer-level isolation environments or pods (microenvironments) to provide a more controllable, cleaner wafer environment during wafer processing. It has been shown that pods can be effective in reducing the amount of particulate contamination on wafers during manufacturing. However, there have also been studies that indicate that pods and wafer boxes can be the source of condensible, molecular organic contamination. This paper summarizes the work that has been performed during the past year at Sandia National Laboratories' Contamination Free Manufacturing Research Center (CFMRC) on (1) devising standard, low-temperature, high sensitivity techniques to detect outgassing of volatile organic compounds (VOCs) from polymers used to construct wafer pods and (2) development of a technique that can be used to continuously measure the condensible contamination within pods so that the pod environment can be monitored during manufacturing. Although these techniques have been developed specifically for assessing contamination threats from wafer pods, they can be used to evaluate other potential contamination sources. The high sensitivity outgassing techniques can be used to evaluate outgassing of volatiles from other clean-room materials and the real-time outgassing sensor can be used to monitor contamination condensation in non-pod environments such as ballroom-type cleanrooms and minienvironments.

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