Mechanical Integrity Issues at MCM-Cs for High Reliability Applications

摘要

During the qualification of a new high reliability low-temperature cofired211u001eceramic (LTCC) multichip module (MCM), two issues relating to the electrical and 211u001emechanical integrity of the LTCC network were encountered while performing 211u001equalification testing. One was electrical opens after aging tests that were 211u001ecaused by cracks in the solder joints. The other was fracturing of the LTCC 211u001enetworks during mechanical testing. Through failure analysis, computer modeling, 211u001ebend testing, and test samples, changes were identified. Upon implementation of 211u001eall these changes, the modules passed testing, and the MCM was placed into 211u001eproduction.