机译:GaN-on-diamond电子设备的可靠性:机械和热机械完整性
Center for Device Thermography and Reliability, H.H. Wills Physics Laboratory, University of Bristol, Bristol BS8 1TL, United Kingdom,Interface Analysis Center, H.H. Wills Physics Laboratory, University of Bristol, Bristol BS8 1TL, United Kingdom Department of Materials, University of Oxford, Oxford OX1 3PH, United Kingdom;
Center for Device Thermography and Reliability, H.H. Wills Physics Laboratory, University of Bristol, Bristol BS8 1TL, United Kingdom;
Center for Device Thermography and Reliability, H.H. Wills Physics Laboratory, University of Bristol, Bristol BS8 1TL, United Kingdom;
Element-Six Technologies, Santa Clara, California 95054, USA;
Element-Six Technologies, Santa Clara, California 95054, USA;
Element-Six Technologies, Santa Clara, California 95054, USA;
Center for Device Thermography and Reliability, H.H. Wills Physics Laboratory, University of Bristol, Bristol BS8 1TL, United Kingdom;
机译:柔性电子器件瞬态热力学分析的理论与实验研究
机译:功率电子组件:用于连接装置的金锡焊料的热机械降解
机译:电子设备中微米级的热机械故障准则
机译:将热机械可靠性预测集成到带引脚倒装芯片器件的协同设计中的方法
机译:关于提高无源和有源微电子器件的热机械性能和冲击可靠性。
机译:通用测试设备实现各种重复的机械变形以评估柔性电子设备的可靠性
机译:GaN-on-Diamond电子设备的可靠性:机械和热机械完整性
机译:提高煤气化工艺整体耐火衬里的力学可靠性。耐火衬里工艺容器热力学分析的数学模型