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PACKAGE FOR THERMO-MECHANICAL RELIABILITY ENHANCEMENTS OF ELECTRONIC ASSEMBLIES
PACKAGE FOR THERMO-MECHANICAL RELIABILITY ENHANCEMENTS OF ELECTRONIC ASSEMBLIES
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机译:电子组件的热机械可靠性增强软件包
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摘要
Surface mount packages (70) having pre-applied underfill (50) thereon and methods of fabricating and using such packages are provided. Supplying customers with packages having pre-applied underfill enhances the thermal and mechanical reliability of surface mount packages and also, mitigates the customers' needs for additional cost, tooling, man-power, and process operations relating to the application and curing of underfill material.
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