Constitutive Model Development for Predicting Thermal Mechanical FatigueDeformation in Solder Interconnects

摘要

A unified creep-plasticity (UCP) model was developed to describe the deformationof 97In-3Ag (wt. percent) solder for the purpose of predicting thermal mechanical fatigue in electronic interconnects. The UCP model uses a hyperbolic sine function of effective stress in its kinetic equation for the inelestic strain rate.