Physical Models for Predicting the Effect of Atmospheric Corrosion on Microelectronic Reliability

摘要

Atmospheric corrosion is a stockpile age-related degradation mode that has a high likelihood of occurrence and the potential for significant consequence. As such, our science-based stockpile stewardship mission requires that we develop and use an analytical capability to predict any effect corrosion can have on weapon reliability. Presently, the stockpile contains numerous microelectronic devices contained in ceramic hermetic packages (CHP). However, the unavailability of CHP devices is already driving the insertion of plastic-encapsulated microelectronic (PEM) devices into stockpile electrical components. A significant concern with the use of PEM devices is the uncharacterized effect corrosion can have on device reliability during the long-term dormant storage conditions associated with our systems. Effective assessments of microelectronic corrosion damage must be based on a physical understanding of the moisture-related phenomena relevant to metallization failure. The main objective of this project was to provide this needed foundation specifically for the corrosion of aluminum, the prime vulnerability. A phased approach was followed throughout this project that has culminated in a predictive toolset that includes a constitutive model for the controlling corrosion processes combined with advanced computational techniques that allow process and environmental uncertainties to be explicitly addressed.