Comparison of Metallization Systems for Thin Film Hybrid Microcircuits. Part II. Corrosion Susceptibility and Solderability

摘要

Corrosion susceptibility and solderability were evaluated for thin film Cr/Pd/Au, Ti/Pd/Au, and the currently used evaporated chromium/gold system. Both evaporated and electroplated gold were included in the Cr/Pd/Au and Ti/Pd/Au samples. For the corrosion susceptibility evaluation, circuits from each system were exposed to various solutions used in the fabrication process, and the percent change in interface resistance was measured as a function of time. For the solderability evaluation, solder filled via resistance and solder bond strengths were measured after temperature cycling. The electroplated gold systems with a palladium layer showed better corrosion resistance and solderability than evaporated chromium/gold. (ERA citation 05:017956)