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Corrosion susceptibility of thin-film metallizations

机译:薄膜金属化层的腐蚀敏感性

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Anodic DC polarization and AC electrochemical impedance-spectroscopy techniques were applied to obtain a better understanding of the corrosion process in Al and Al-Cu thin-film metallizations. The oxide-layer resistance, oxide-layer/double-layer capacitance, and anodic-polarization scans of Al and Al-Co thin-film metallizations which have been sputtered onto partially oxidized silicon substrates are correlated to oxide-layer thickness, Cu distribution, and oxide-layer integrity. Auger electron spectroscopy was employed to quantify oxide-layer thickness and its apparent influence on impedance-spectroscopy response, while scanning electron microscopy was used to observe the type of corrosion attack. The results discussed are compared with results previously obtained on bulk Al-Co alloys.
机译:阳极直流极化和交流电化学阻抗谱技术用于更好地了解Al和Al-Cu薄膜金属化过程中的腐蚀过程。已溅射到部分氧化的硅衬底上的Al和Al-Co薄膜金属化层的氧化物层电阻,氧化物层/双层电容以及阳极极化扫描与氧化物层厚度,Cu分布,和氧化层的完整性。俄歇电子能谱法用于量化氧化层厚度及其对阻抗谱响应的明显影响,而扫描电子显微镜则用于观察腐蚀的类型。将讨论的结果与先前在块状Al-Co合金中获得的结果进行比较。

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