Room Temperature and Elevated Temperature Deformation Characteristics of Inconel X-750

摘要

Thin foil electron microscopy techniques were used to characterize the dislocation behavior of Inconel X-750 tensile specimens tested at temperatures ranging from room temperature of 1500 exp 0 F (816 exp 0 C). Operative dislocation mechanisms were related to the fracture surface morphologies and the overall tensile response of this nickel-base alloy. Under room temperature and intermediate temperature conditions, a rather extensive dislocation substructure throughout the matrix was associated with the ductile response exhibited by Inconel X-750. In the higher temperature regime, approximately 1200 to 1300 exp 0 F (649 to 704 exp 0 C), all dislocation activity was channeled through narrow slip bands which subsequently initiated localized separation and a very faceted fracture surface appearance. The absence of a homogeneous dislocation substructure in this temperature regime resulted in a severe degradation in ductility levels. At the highest test temperature, 1500 exp 0 F (816 exp 0 C), a uniform dislocation network throughout the Inconel X-750 matrix coupled with intense dislocation activity adjacent to the grain boundaries resulted in a marked improvement in ductility. (ERA citation 05:008844)