High Temperature Electrically Conductive Adhesives

摘要

A non-proprietary electrically conductive, high-temperature adhesive has been developed. The base resin is a commercial bismaleimide resin with silver particles added to produce electrical conductivity. This adhesive has been formulated for use in our microelectronic area as a die-attach adhesive. Following a typical chip processing cycle (350 deg C for one hour), the adhesive has a strength of 8.3 MPa and a volume resistivity of 10 sup -4 ohm.cm. (ERA citation 12:028868)