Glancing Angle EXAFS Studies of Cu-Al Thin Film Interfaces

摘要

The glancing angle EXAFS technique has been employed to study the initial reactions on Cu-Al thin film interfaces. Samples prepared under uhv and non-uhv conditions are compared. Preliminary data indicate that the uhv prepared interface has a larger amount of initial reaction than the non-uhv one. When annealed at 160/degree/C, the resulting compound formation at the interfaces of the two samples are different. 4 refs., 1 fig., 1 tab. (ERA citation 14:008366)