X-Ray Diffraction Characterization of Process-Induced Residual Stress

摘要

The U.S. Army Research Laboratory - Materials Directorate (ARL-MD) has utilizedthe x-ray diffraction (XRD) method of residual stress analysis (RSA) to characterize process-induced residual stress on a variety of polycrystalline metal and ceramic materials. As part of the mechanical failure investigation, modem XRD RSA techniques provide a direct means for quantifying residual stress