Novel, Flexible Approach to Packaging Integrated Microsystems for Space Applications

摘要

The European Aeronautic Defence and Space Company (EADS) recognizes the potential for Microsystems Technology (MST) to disrupt and revolutionize the space industry, where it can dramatically reduce mass, size, and power requirements, and, therefore, mission cost. EADS is developing a novel modular approach to packaging integrated microsystems for space applications, called "micropacks." The micropack include suites of commercial off-the- shelf (COTS) MST sensors, packaged and integrated into a 3D modular multi-layer ceramic package. This impressively light and compact micropack technology can be adapted to form the basis of a solution for a range of exciting future mission concepts, such as the following: (1) highly integrated multi-functional nanosatellites (e.g. for solar terrestrial physics or space weather monitoring); (2) planetary aerobots on Mars, Venus, the Giant Planets, and Titan (e.g. as a payload/system package); (3) sub-100g planetary microprobes for measuring atmospheric profiles; (4) solar sails (e.g. as the central hub of the spacecraft); (5) penetrators (e.g. as a payload/system package); and (6) robotic planetary explorers (e.g. landers, rovers, walkers, hoppers). The micropack consists of five ceramic layers, including an atmospheric sensor unit (e.g. pressure sensor), an acceleration sensor unit, a power supply unit, a data handling unit (a Texas Instruments MSP430 micro-controller), and a chip- size radiofrequency transceiver unit laminated into the ceramic. Each module has a standardized interface, which ultimately combines with other modules to form a system platform. The size of the micropack will be a mere 20x25x25mm(exp 3), with power consumption of less than 100mW and a mass of just 25g.