PACKAGING MINIATURIZATION

机译：包装微型化

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This project was originally, designed to evaluate three out of tennPackaging concepts High Power Amplifier Para-Plate modules were built and functionally tested. A few prototype modules using Weld Pack and Chem.-Mill techniques were constructed.

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SHIRO ABE; STUART CHURCHON; H. L.NEWMAN;
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年度 1961
页码 1-137
总页数 137
原文格式 PDF
正文语种 eng
中图分类工业技术;
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PACKAGING MINIATURIZATION

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