MICROMINIATURE INTEGRATED CIRCUIT PACKAGE Third Quarterly Progress Report

摘要

Twenty four Westinghouse Molecular Electronic Blocks were encapsulated in the .225 X .225 X .045 integrated circuit package. No problems in assembly or sealing were encountered. Also six Westinghouse Audio amplifiers and two detectors were encapsulated. Two 10.3 Mc quartz crystal and eight 455 Kc filters were purchased. These devices and components were forwarded with 90 sealed integrated circuit packages to the Signal Corps to fulfill sample requirements. Also a thorough study of packages fabricated utilizing improved processing techniques were sealed and measured for hermeticity. These were. lower in leak rate than previous packages by at least one order of magnitude. These same packages were forwarded to CEC for RADIFLO comparison measurements.nA pilot run of 1000 micro miniature integrated circuit packages was started in March. Application data for integrated circuit assembly in the .220" X ,220" package was prepared.