Printed Wiring Assembly and Interconnection Reliability

摘要

This report presents reliability prediction models for printed wiring assemblies, solderless wrap assemblies, wrapped and soldered assemblies, and discrete wiring assemblies w/electroless deposited PTH for inclusion in MIL-HDBK-217. Collected field failure rate data were utilized to develop and evaluate the factors. The reliability prediction models are presented in a form compatible with MIL-HDBK-217D, proposed. (Author)