Special Techniques for the Auger Analysis of Microelectronic Devices

摘要

Microelectronic devices are becoming more complex and device features are getting smaller as the level of integration continues to increase. Although scanning Auger microscopy has been applied extensively to the analysis of microelectronic devices with a great deal of success, the analysis of current and future devices is presenting new challenges. The major limitations are: (1) features of interest in microelectronic circuits are often comparable in size to the beam diameter of commercial Auger microprobes, and (2) the electron beam tends to drift about on the specimen surface because of mechanical instability and differential thermal expansion of the apparatus. In this technical report, we present information on two different techniques that were developed to overcome these limitations. In the specimen modulation technique, the modulating signal is applied to the electrically analyzer. This method of modulation permits the detection of only the Auger electrons that are emitted from the modulated region.