Natural Convection Immersion Cooling of an Array of Simulated Chips in an Enclosure Filled with Dielectric Liquid

摘要

An experimental natural convection heat transfer study of a simulated electronic circuit board has been conducted. The board has an array of 9 simulated chips, each dissipating up to 2.5 Watts. The board is immersed in FC75, a fluorocarbon liquid, in an enclosure whose top and bottom surfaces are constant temperature heat sinks. The experimental data have been expressed in terms of relevant dimensionless heat transfer parameters such as Nusselt and Rayleigh numbers. The trend is that, the chips located higher in the enclosure have lower heat transfer rates. Otherwise the chips in the same row behave in a similar way which implies a quasi-two dimensionality.