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Natural convection immersion cooling of an array of simulated chips in an enclosure filled with dielectric liquid.

机译：自然对流浸没在充满电介质的外壳中的一组模拟芯片的自然冷却。

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http://archive.org/details/naturalconvectio00pamu

机译：HTTP://archive.org/details/natural convect IO00帕慕

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Pamuk Turgay.; Kelleher Matthew D.;
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年度 1987
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正文语种 en_US
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1. Laminar natural convection from a vertical array of horizontal heated cylinders inside a water-filled rectangular enclosure cooled at sides [J] . Marta Cianfrini, Massimo Corcione, Alessandro Quintino, International journal of numerical methods for heat & fluid flow . 2020,第5期

机译：层流自然对流从水上矩形外壳内的水平加热圆柱体的垂直阵列进行冷却
2. Three dimensional numerical analysis of natural convection cooling with an array of discrete heaters embedded in nanofluid filled enclosure [J] . Purusothaman A., Nithyadevi N., Oztop H. F., Advanced Powder Technology: The internation Journal of the Society of Powder Technology, Japan . 2016,第1期

机译：纳米流体填充外壳中嵌入离散加热器阵列的自然对流冷却的三维数值分析
3. Natural convective cooling of electronics contained in tilted hemispherical enclosure filled with a porous medium saturated by water-copper nanofluid [J] . Bairi Abderrahmane, Bauzin Jean-Gabriel, Martin-Garin Alexander, International journal of numerical methods for heat & fluid flow . 2019,第1期

机译：倾斜的半球形外壳中装有充满水铜纳米流体饱和的多孔介质的电子器件的自然对流冷却
4. AIR COOLING STUDY OF TRANSIENT NATURAL CONVECTION HEAT TRANSFER FROM SIMULATED ELECTRONIC CHIPS [C] . H. Bhowmik, K. W. Tou HTD-vol.375-3; American Society of Mechanical Engineers(ASME) International Mechanical Engineering Congress and Exposition vol.3; 20041113-19; Anaheim,CA(US) . 2004

机译：模拟电子芯片瞬态自然对流传热的空气冷却研究
5. Passive cooling of discretely heated closed and partially open enclosures by combined conduction, natural convection and radiation. [D] . Yu, Enchao. 1997

机译：通过传导，自然对流和辐射的组合，对离散加热的封闭和部分开放的外壳进行被动冷却。
6. Numerical simulation of MHD double diffusive natural convection and entropy generation in a wavy enclosure filled with nanofluid with discrete heating [O] . Rujda Parveen, T.R. Mahapatra 2019

机译：离散加热纳米流体填充的波浪形壳体内MHD双扩散自然对流和熵产生的数值模拟
7. An advanced study of natural convection immersion cooling of 3 x 3 array of simulated components in an enclosure filled with dielectric liquid [O] . Benedict Terry J. 1988

机译：在充满电介质的外壳中自然对流浸没冷却3 x 3模拟组件阵列的高级研究

Natural convection immersion cooling of an array of simulated chips in an enclosure filled with dielectric liquid.

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