Micro-Time Stress Measurement Device Development

摘要

This report describes the Micro-Time Stress Measurement Device (TSMD) developedand delivered under this contract. The Micro-TSMD is a microprocessor controlled device to read the installed environmental sensors and record their results in a non-volatile memory. It is contained in a hybrid package about 1 x 1.8 x 0.2 (inches), weighing less than an ounce. The TSMD contains sensors for temperature, mechanical vibration/shock, and DC voltage monitoring, including transients, and may be connected to external sensors. It requires external power. This project was funded by the RAMTIP Program Office at WPAFB OH.