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首页> 外文期刊>Physical chemistry chemical physics: PCCP >Electrochemical in situ STM study of Al and Ti-Al alloy electrodeposition on Au(111) from a room temperature molten salt electrolyte
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Electrochemical in situ STM study of Al and Ti-Al alloy electrodeposition on Au(111) from a room temperature molten salt electrolyte

机译:室温熔融盐电解质在Au(111)上电沉积Al和Ti-Al合金的电化学原位STM研究

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The electrodeposition of Al and Ti-Al alloys on Au(111) from an acidic aluminium chloride-1-methyl-3-butylimidazolium chloride (AlCl3-MBImC) room-temperature molten salt electrolyte containing TiCl4 was studied by cyclic voltammetry and chronoamperometry and in particular, nucleation and growth processes were monitored in situ by means of electrochemical scanning tunneling microscopy (EC-STM) for the first time. Two underpotential deposition (UPD) states for Al were observed in the cyclic voltammogram at 0.51 and +0.22 V vs. Al/Al3+. At corresponding UPD conditions STM images show different nucleation behavior for Al: first a growth of clusters all over the Au surface, and later preferentially along the step edges leading to a step edge decoration. Potential step experiments imply progressive nucleation and growth and are evidenced by STM images obtained at different time intervals showing the growth of Al clusters of up to 8 nm diameter in size. After anodic dissolution of the deposited Al film, the appearance of circular holes of a size comparable with the Al clusters notably along Au step edges indicates Al-Au surface alloy formation. Tunneling current vs. bias voltage (I-U) curves of the Al clusters exhibit a reduced tunneling barrier height (Phi) of 0.23 eV. A distinct two-dimensional nucleation of Ti-Al clusters begins to occur at 0.5 V vs. Al/Al3+ exclusively on the Au terraces. They grow in the form of chains reaching a size of about 2-3 nm diameter in size, smaller in comparison with Al clusters. X-Ray photoelectron spectra of the potentiostatically deposited film under overpotential deposition (OPD) conditions confirm the formation of a Ti-Al alloy phase.
机译:通过循环伏安法和计时电流法研究了在含AuCl的酸性氯化铝-1-甲基-3-丁基咪唑鎓氯化铝(AlCl3-MBImC)室温熔融盐电解质中在Al(111)上电沉积Al和Ti-Al合金的过程。特别是,首次通过电化学扫描隧道显微镜(EC-STM)原位监测成核和生长过程。在循环伏安图中,在相对于Al / Al3 +的0.51和+0.22 V电压下观察到Al的两个欠电位沉积(UPD)状态。在相应的UPD条件下,STM图像显示出Al的不同成核行为:首先在Au表面整个簇生长,然后优先沿着台阶边缘进行装饰,从而形成台阶边缘。潜在的分步实验暗示进行性成核和生长,并通过在不同时间间隔获得的STM图像证明,该图像显示了直径最大为8 nm的Al团簇的生长。在阳极沉积的铝膜溶解后,圆形孔的大小与铝簇相当,特别是沿着金台阶边缘出现的圆形孔表明铝-金表面合金的形成。 Al团簇的隧穿电流与偏置电压(I-U)曲线显示出隧穿势垒高度(Phi)降低了0.23 eV。 Ti-Al团簇的独特二维成核现象始于0.5 V,而Al / Al3 +仅在Au台阶上。它们以链的形式生长,达到直径约2-3 nm的大小,比Al簇小。恒电位沉积(OPD)条件下恒电位沉积膜的X射线光电子能谱证实形成了Ti-Al合金相。

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