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Trap-assisted recombination in semiconductors: application to group III gallium nitride material and junctions

机译:半导体中的陷阱辅助复合:在III族氮化镓材料和结中的应用

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摘要

An improved model for trap-assisted recombination taking into account Shockley-Read-Hall recombination, trap-assisted Auger (TAA) recombination and tunnelling due to the electric field has been developed. To our knowledge, this is the most general model for trap-assisted recombination reported in the literature. The model describes the weak temperature dependence of the recombination rate for the bulk, but the strong temperature dependence of the recombination rate for the depletion region. The TAA process contributes weakly to the net recombination unless the doping is very heavy. However, it contributes heavily to recombination in the junction depletion region even at relatively lower doping levels. The calculated minority-carrier lifetime and diffusion length closely correspond to the average experimental data. [References: 43]
机译:已经开发了一种改进的陷阱辅助重组模型,该模型考虑了Shockley-Read-Hall重组,陷阱辅助俄歇(TAA)重组以及由于电场引起的隧穿。据我们所知,这是文献中报道的最普遍的陷阱辅助重组模型。该模型描述了整体的重组率对温度的依赖性较弱,而耗尽区的重组率对温度的依赖性较强。除非掺杂非常重,否则TAA工艺对净重组的贡献很小。然而,即使在相对较低的掺杂水平下,它也对结耗尽区中的重组起了很大的作用。计算出的少数载流子寿命和扩散长度与平均实验数据非常接近。 [参考:43]

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