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Deposition of epitaxial yttria-stabilized zirconia on single-crystal Si and subsequent growth of an amorphous SiO2 interlayer

机译:在单晶硅上沉积外延氧化钇稳定的氧化锆并随后生长非晶SiO2中间层

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摘要

A processing technique is developed to fabricate single-crystal yttria-stabilized zirconia (YSZ) on amorphous SiO2 on (100) single-crystal Si. The YSZ layer shows high crystallinity with an ion beam channelling minimum of 11 % from Rutherford backscattering. Even though there is a thick intervening amorphous SiC>2 layer between the Si and the YSZ, the single-crystal YSZ layer is aligned with the crystal Si. The tilt and rotation variations are 0-64° and Ml0 respectively, based on X-ray diffraction co-rocking curves on [100] and cj> scans on [202] of YSZ films. The epitaxial nature of the YSZ on the thick SiO2 layer (from 10 to 100 nm) is further confirmed by high-resolution cross-sectional transmission electron microscopy analysis. This processing and the resulting multilayer structure might provide a new option for fabricating innovative microelectronic devices.
机译:开发了一种在(100)单晶硅上的非晶SiO2上制备单晶氧化钇稳定氧化锆(YSZ)的加工技术。 YSZ层显示出高结晶度,而离子束由于卢瑟福反向散射而至少有11%的通道。即使在Si和YSZ之间存在厚的中间非晶SiC 2层,单晶YSZ层也与晶体Si对准。基于YSZ薄膜[100]的X射线衍射共同摇摆曲线和[202]的cj>扫描,倾斜和旋转变化分别为0-64°和Ml0。 YSZ在厚SiO2层(从10到100 nm)上的外延特性通过高分辨率截面透射电子显微镜分析得到了进一步证实。这种处理方法和由此产生的多层结构可能为制造创新的微电子器件提供新的选择。

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