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The influence of grain size on the indentation hardness of high-purity copper and aluminium

机译:晶粒度对高纯铜铝压痕硬度的影响

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Quasistatic microindentation hardness studies of specimens of high-purity polycrystals and single crystals of copper and aluminium have been made at room temperature using a Vickers diamond and a tungsten carbide-cobalt sphere of radius 200mum. The polycrystalline specimens of copper were prepared by heavy deformation of as-received specimens followed by thermal annealing at different temperatures and for different times; the grain sizes produced were in the range 15-520 mum. The polycrystalline samples of the as-received aluminium had a grain size of 330 +/- 40 mum. As-formed specimens of copper of different grain sizes were found to have different dislocation densities; the smaller the grain size, the higher was the dislocation density. The Vickers hardness for a given indenter load, determined using the projected contact areas of indentations, was found to increase with decreasing grain size. Similarly. the Meyer hardness increased with decreasing grain size. It is argued that the observed increase in hardness of the polycrystals with decreasing grain size is due to the initial dislocation densities in the grains and not due to the grain boundaries which, because of the lack of impurities at them, do not appear to act as dislocation barriers in these high-purity fcc metals. Moreover, as the indentation hardness values of single crystals of copper of different orientations are very similar, any differences in the orientations of contiguous grains will not affect the hardness values of polycrystals. Thus for large single crystals of copper (10 mm x 10 mm x 10 mm), having the same dislocation density as that of the polycrystalline specimens of copper of grain size 15 +/- 7 mum, the indentation hardness values were quite similar. Experimental results from the indentation hardness tests, made using both Vickers and spherical indenters, on polycrystalline aluminium specimens and relatively large single crystals showed that there was insignificant influence of the grain size. [References: 28]
机译:使用维克斯钻石和半径为200mum的碳化钨-钴球在室温下对高纯度多晶和铜和铝的单晶样品进行了准静态微压痕硬度研究。铜的多晶试样是通过按原样对试样进行大变形,然后在不同温度,不同时间进行热退火来制备的。产生的晶粒尺寸在15-520微米的范围内。如此接收的铝的多晶样品具有330 +/-40μm的晶粒尺寸。形成的不同晶粒尺寸的铜试样具有不同的位错密度。晶粒尺寸越小,位错密度越高。对于给定的压头载荷,使用压痕的投影接触面积确定的维氏硬度随晶粒尺寸的减小而增加。同样。迈耶硬度随着晶粒尺寸的减小而增加。有人认为,随着晶粒尺寸的减小,观察到的多晶硬度的增加是由于晶粒中的初始位错密度,而不是由于晶界,因为晶界缺乏杂质,晶界似乎不起作用。这些高纯度fcc金属中的位错壁垒。此外,由于不同取向的铜单晶的压痕硬度值非常相似,因此连续晶粒的取向的任何差异都不会影响多晶的硬度值。因此,对于具有与晶粒尺寸为15 +/-7μm的铜的多晶试样相同的位错密度的铜的大单晶(10mm×10mm×10mm),压痕硬度值非常相似。使用维氏和球形压头对多晶铝样品和相对较大的单晶进行压痕硬度测试的实验结果表明,晶粒尺寸的影响微不足道。 [参考:28]

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