Bonding Linerboard with Hot Melt Adhesive

摘要

Hot melts are limited in their capability to penetrate low porosity substrates, wet out very rough surfaces, and form bonds in the presence of contaminants. However, they continue to be one of the most preferred adhesives in automated production lines. Understanding key factors associated with the liner, hot melt, application and other conditions can simplify the process of hot melt adhesive selection and resolve hot melt bonding problems.