This paper presents the results of theoretical optimization of the multi-chip-module (MCM) contact and driver circuitries for gigabit chip-to-chip communication. Optimization has been done using 3D electromagnetic (EM) simulations of MCM contacts and time domain simulations of drivers and receivers. A single optimized MCM contact has a signal reflection of less than -20 dB for more than 400 GHz bandwidth. The MCM data link with the optimized SFQ driver, receiver and two MCM contacts has operational margins on the global bias current of +/- 30% at 30 Gbit s(-1) speed and can operate above 100 Gbit s(-1) speed. Wide bandwidth transmission requires the realization of an advanced flip-chip process with a small dimension of the MCM contact (less than 30 mu m diameter of the contact pad) and small height of the flip-chip contact bumps of the order of 2 mu m. Current processes with about 7 mu m height of the bumps require the application of a double-flux-quantum (DFQ) driver. The data link with the DFQ driver was also simulated. It has operational margins on the global bias current of +/- 30% at 30 Gbit s(-1); however, themaximum speed of operation is 61 Gbit s(-1). Several test structures have been designed for measurements of signal reflection, bit error rate and operational margins of the data link.
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